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| SPEcial Events
EVENTS STUDENTS University of Cincinnati Miami University Shawnee State Edison Sinclair LINKS |
A Holiday Letter to all members!
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Alloys & Blends Applied Rheology Automotive Bioplastics Blow Molding Building & Construction Color & Appearance Composites Decorating & Assembly Electrical & Electronic Engineering Properties & Structure Extrusion Failure Analysis & Prevention |
Flexible Packaging |
Process Monitoring & Control Product Design & Development Radiation Processing of Polymers Rotational Molding Thermoforming Thermoplastic Elastomers Thermoplastic Materials & Foams Thermoset Undergraduate Students Vinyl Plastics |
Abstract Deadline September 1, 2008
Manuscript Deadline November 14, 2008
Manuscript Revision Deadline January 9, 2009
Questions? Contact:
Peter Boergermann
Technical Program Coordinator
Ph: +1 203-740-5472
Email: pboergermann@4spe.org
antecpapers@4spe.org
Lesley Kyle
Senior Event Manager
Ph: +1 203-740-5452
Email: lskyle@4spe.org
antec@4spe.org
© 2008 Miami Valley Society of Plastics Engineers.